Siemens AG (ADR: SIEGY), a leading technology company, and Intel Corporation (Nasdaq: INTC), one of the world’s largest semiconductor companies, have signed a Memorandum of Understanding (MoU) to collaborate on driving digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.
The MoU identifies key areas of collaboration to explore a variety of initiatives, including optimizing energy management and addressing carbon footprints across the value chain. For instance, the collaboration will explore use of “digital twins” of complex, highly capital-intensive manufacturing facilities to standardize solutions where every percentage of efficiency gained is meaningful.
The collaboration will also explore minimizing energy use through advanced modeling of natural resources and environmental footprints across the value chain. To gain more information on product-related emissions, Intel will explore product and supply chain related modeling solutions with Siemens that drive data-based insights and help the industry accelerate progress in reducing its collective footprint.
Sustainable practices across the entire semiconductor lifecycle, including design, manufacturing, operation, efficiency, and recycling, are critical for meeting growing demand for powerful, sustainable chips. Technology has the power to accelerate solutions to reduce computing-related climate impacts across the technology industry and the rest of the global economy. Automation and digitalization hold the key to addressing the challenges as the industry drives toward net-zero greenhouse gas emissions. By combining their strengths and expertise, Siemens and Intel are poised to lead the way in driving positive change.
Forward-Looking Statements
This press release may contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, including expected delivery dates. Such statements are based on current expectations and projections about our future results, prospects and opportunities and are not guarantees of future performance. Such statements will not be updated unless required by law. Actual results and performance may differ materially from those expressed or forecasted in forward-looking statements due to a number of factors, including those discussed in our filings with the Securities and Exchange Commission.
